NEDO: GaN-HEMT with single crystal diamond substrate: For mobile base stations 、 satellite communications

NEDO: GaN-HEMT with single crystal diamond substrate: For mobile base stations 、 satellite communications

NEDO / Mitsubishi Electric / National Institute of Advanced Industrial Science and Tech

‘Multi-cell structure GaN-HEMT’:

Developed the world’s first ‘multi-cell structure GaN-HEMT’.

Introducing the multi-cell gallium nitride high electron mobility transistor (GaN-HEMT).

This time, we adopted single crystal diamond with high thermal conductivity for the heat dissipation substrate.

 it will be installed in high-frequency power amplifiers for mobile communication base stations and satellite communication systems.

The ‘multi-cell structure GaN-HEMT’ improves power efficiency and lowers power consumption.

Conventional technology: Disadvantages of GaN-HEMT: Heat generation during high power operation

In recent years, high-power and high-efficiency gallium nitride high electron mobility transistors (GaN-HEMT * 1) have been used in high-frequency power amplifiers for mobile communication base stations and satellite communications.

However, the GaN-HEMT has a problem that current does not flow easily due to heat generation during high output operation.

Current technology: Direct bonding of single crystal diamond: High thermal conductivity as a heat dissipation substrate

This time, we succeeded in direct bonding of single crystal diamond (having high thermal conductivity as a heat dissipation substrate).

Developed ‘multi-cell structure GaN-HEMT’ which realized high power and high efficiency by direct bonding of single crystal diamond.

By installing ‘multi-cell structure GaN-HEMT’, the output density and power efficiency of high-frequency power amplifiers can be dramatically improved.

Contributes to lower power consumption in mobile communication base stations and satellite communication systems.

https://www.nedo.go.jp/news/press/AA5_101185.html