JFE Steel: New endless rolling technology: Developed high-tensile bonding equipment
TSMC: Insufficient stock of 300mm wafers: SUMCO, Shin-Etsu Chemical
Saga Univ: Ultimate “Diamond Semiconductor” Developed: Applied to 6G Base Stations
Yokohama Rubber: Efficient generation of butadiene from biomass: Nature Communications
Mitsubishi Chemical: Increased CFRP production in Italy: C.P.C.SRL