EBARA: Developed new polishing equipment: CMP equipment “F-REX300X”
EBARA:
2022 The Fujisawa Plant will start operation of a new semiconductor manufacturing equipment development building.
Development of new polishing equipment:
In the new building, we will focus on the development of Ebara’s mainstay chemical mechanical polishing (CMP) “F-REX300X”.
To be able to respond quickly to technological innovations such as refining semiconductor wiring patterns.
CMP device: “F-REX300X”
“F-REX300X” integrates a polishing function and a cleaning function.
Semiconductors will be miniaturized and refined.
It plays an important role in improving the yield in the semiconductor manufacturing process.
Uniformity of semiconductor polishing and
Accuracy of end point detection,
Cleaning function that does not leave the slurry generated by polishing
Emphasis will be placed on the three characteristics and development will proceed.
Increased dry vacuum pump production:
In 2019, the “Dry Vacuum Pump Development Building and Production Building” will be constructed at the Fujisawa Plant.
Full operation of the dry vacuum pump production building is expected in the latter half of 2021.
In April 2021, a CMP device / production line was added to the Kumamoto Plant.
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