TDK: MEMS “Silicon Chip Sonar” released: ToF calculation, relative distance detection
TDK: MEMS “Silicon Chip Sonar”
June 25, 2019
TDK Corporation will launch Chirp’s MEMS-based ultrasonic Time of Flight sensor (CH-101) worldwide.
Ultrasonic Time of Flight Sonar: (CH-101)
Transmit ultrasonic pulses using a small ultrasonic transducer tip.
Detects the echo returned from an object at the sensor’s viewing angle.
By calculating ToF, the sensor measures the location of the object relative to the device.
TDK: MEMS ultrasonic technology
A unique ToF sensor in a 3.5 mm x 3.5 mm package.
MEMS ultrasonic transducer,
Power efficient digital signal processor (DSP),
Customized Low-Power Mixed-Signal CMOS ASIC
In combination.
The sensor handles various ultrasound signal processing functions.
Distance detection,
Presence / proximity detection,
Object detection / avoidance,
Position tracking,
Provide flexible industrial design to customers in a wide range of use cases.
Consumer electronics,
AR / VR,
Robotics,
Drone,
IoT,
The first MEMS-based ultrasonic ToF sensor designed for the automotive and industrial markets.
https://www.jp.tdk.com/corp/ja/news_center/press/20190625_01.htm