Samsung: No improvement in yield of 3nm:

Samsung: No improvement in yield of 3nm:

-It will be difficult to provide in the first half of 2022-

Samsung 3nm process:

The monthly production of 3nm process is 30,000 to 35,000 wafers (300mm wafer).

We have already received orders from multiple customers such as HPC and smartphone processors.

Yield does not improve:

In 2021, Samsung aimed to “achieve mass production of 3nm process ahead of TSMC”.

Gate All Around (GAA) Structure:

However, Samsung’s GAA does not stand up as expected.

It seems that the yield of 3nm is poor and it is struggling.
TSMC plans to adopt GAA from 2nm
Expected to take nearly a year:

It will take nearly a year for Samsung’s 3nm process yield to stabilize.

It is difficult to achieve mass production according to the schedule presented by Samsung in 2021.

TECH +

https://news.mynavi.jp/techplus/article/20220426-2330741/

Samsung : Aucune amélioration du rendement de 3 nm :

-Il sera difficile de fournir au premier semestre 2022-

Processus Samsung 3 nm :

La production mensuelle du procédé 3nm est de 30 000 à 35 000 wafers (wafer de 300 mm).

Nous avons déjà reçu des commandes de plusieurs clients tels que des processeurs HPC et des smartphones.

Le rendement ne s’améliore pas :

En 2021, Samsung visait à “réaliser la production de masse du processus 3 nm avant TSMC”.

Structure de la porte tout autour (GAA) :

Cependant, le GAA de Samsung ne résiste pas comme prévu.

Il semble que le rendement de 3 nm soit médiocre et qu’il se débatte.
TSMC prévoit d’adopter GAA à partir de 2 nm
Devrait prendre près d’un an :

Il faudra près d’un an pour que le rendement du processus 3 nm de Samsung se stabilise.

Il est difficile de parvenir à une production de masse selon le calendrier présenté par Samsung en 2021.

TECH +

Samsung: Keine Ertragsverbesserung von 3nm:

-Bereitstellung im ersten Halbjahr 2022 schwierig-

Samsung 3nm-Prozess:

Die monatliche Produktion des 3-nm-Prozesses beträgt 30.000 bis 35.000 Wafer (300-mm-Wafer).

Wir haben bereits Bestellungen von mehreren Kunden wie HPC und Smartphone-Prozessoren erhalten.

Ertrag verbessert sich nicht:

Im Jahr 2021 strebte Samsung an, „die Massenproduktion des 3-nm-Prozesses vor TSMC zu erreichen“.

Gate All Around (GAA) Struktur:

Samsungs GAA hält sich jedoch nicht wie erwartet.

Es scheint, dass die Ausbeute von 3nm schlecht ist und es Probleme gibt.
TSMC plant, GAA von 2nm zu übernehmen
Voraussichtlich fast ein Jahr dauern:

Es wird fast ein Jahr dauern, bis sich die Ausbeute des 3-nm-Prozesses von Samsung stabilisiert hat.

Es ist schwierig, die Massenproduktion nach dem von Samsung vorgelegten Zeitplan im Jahr 2021 zu erreichen.

TECH+

TSMC, ‘3-nano’ confidence… Focus on Samsung’s ‘Foundry’ Strategy

Samsung Electronics
started mass production of 3 nanometers ahead of TSMC,

but it is predicted that competition for yield or customer acquisition

will not be easy with those who are following quickly, so attention is focused on strategies for making a breakthrough in the future.

According to foreign media such as Taiwan’s Digitimes on the 18th,

TSMC is ready
to mass-produce 3-nano process chips in the second half of this year.

It is expected that the 3nm process will be able to process 30,000 to 35,000 wafers per month only at the beginning of mass production.

Samsung, ahead of TSMC last year,

set the goal of succeeding in mass production of the 3nm process within the first half of this year and is implementing it,

but problems such as yield and securing customers can act as decisive variables in 3nm competition.

Samsung’s 3-nano gate all-around (GAA) process was evaluated

as the basis for its technological prowess to catch up with TSMC and raised expectations. The industry’s view is that it doesn’t mean much.

Samsung Electronics’ new head of semiconductor (DS) division,

Kye-Hyun Kye,
is leading the way to improve the organizational structure that enables more efficient work, while at the same time communicating between employees.

Internet New Daily

https://biz.newdaily.co.kr/site/data/html/2022/04/17/2022041700088.html