JSR: Development of insulating material for 5G-Low Loss TPE FCCL
JSR Corporation: (CEO: Eric Johnson)
Completed development and launched sales of low dielectric constant, low dielectric loss tangent insulation materials for 5G mobile communication systems (5G).
In the high frequency region used in 5G, low dielectric constant, low dielectric loss tangent printed circuit board materials are required to reduce signal transmission loss.
High frequency printed circuit board: Insulating material
JSR has developed an insulating material for high frequency printed circuit boards that features low dielectric constant and low dielectric loss tangent.
This material is used in smartphones etc.
It has high adhesion as a base film and low-roughened copper foil for flexible copper clad laminate (FCCL).
Features of this material:
Maintains excellent electrical characteristics even when used under high temperature and humidity.
A thermosetting material with high flowability before curing.
Excellent embedding of high frequency printed circuit board wiring.
Processable below 200 ° C (general equipment can be used).
It also has excellent hole-forming processability and adhesion with plating, which are necessary for connecting the upper and lower wiring layers of the printed circuit board.
5G requirements: high-speed transmission, high capacity
5G is a communication technology that is used for mobile phones and other devices that achieve 100 times higher transmission speed and 1,000 times higher capacity than the current situation.
Low Loss TPE (Thermosetting Polyether) FCCL using this material is jointly held with Kohoku Ouma Electronics Technology Co., Ltd. at the 5G / IoT Communication Exhibition held at Tokyo Big Sight Aokai Exhibition Building from July 17th to 19th. I will exhibit.
2019 | News-JSR Corporation
http://www.jsr.co.jp/news/0000825.shtml
湖北奥馬電子科技有限公司