TSMC: Japan’s flip chip technology Target: IBIDEN and Shinko Electric
-“Manufacturing technology with a line width of 2 nanometers”-
-“3D technology to increase integration per area “-
Semiconductor materials and manufacturing equipment:
Japan is one of the world’s leading player in semiconductor materials and manufacturing equipment.
Ministry of Economy, Trade and Industry of Japan:
METI wants to make semiconductor materials and manufacturing equipment companies “growth triggers.”
Development support for front-end process technology: “Manufacturing technology with a line width of 2 nanometers”
METI in March selected a company that supports the development of “pre-process” technology for writing circuits on wafers.
Tokyo Electron,
Canon,
Adopted SCREEN (Kyoto City).
In anticipation of future competition, we will establish “manufacturing technology with a line width of 2 nanometers”.
Support for development of post-process technology: “3D technology to increase area and integration”
Japan takes the lead in “development of post-process technology to cut out chips from wafers and commercialize them”.
The competition to narrow the line width will eventually reach its limit.
By stacking circuits, we will develop “a technology to increase the degree of integration per area in three dimensions”.
TSMC’s Advanced Development Base:
TSMC establishes a new development base in Tsukuba City, Ibaraki Prefecture.
The advanced semiconductor manufacturing technology development base is expected to be the center of the concept.
From the Japan
Ibiden, Shinko Electric Industry, etc.
Participation of companies strong in this field is expected.
Digitization Strategy Formulation: Government Study Group
Based on past failures
5G and data centers,
EV and smart city,
Promote support measures to boost the major semiconductor market fields.
Denso and NTT also participated in the study group.
Reuters
https://jp.reuters.com/article/semiconductor-japan-idJPKBN2CV0ZU