TSMC: Japan’s 3DIC Participating Members:
TSMC:
June 24, 2022,
The opening ceremony of “TSMC Japan 3DIC R & D Center” was held.
TSMC Japan
3DIC R & D Center
At the 3DIC center, we will challenge the “limits of semiconductor miniaturization”.
Develop “technology that enables mass production of 3D packages in the post-process”.
Japanese material maker,
Equipment manufacturer,
Conducted in joint research with research institutes.
TSMC CEO
As the “physical limits of semiconductor microfabrication technology” approach,
“3D packaging technology” is becoming more important.
At TSMC,
As a next-generation semiconductor manufacturing technology
In the post-process, multiple chips are laminated in 3D at high density,
To function as one semiconductor,
We are focusing on 3D laminated packaging technology.
Participating companies and organizations:
Material manufacturer:
Asahi Kasei, Ividen, JSR, Showa Denko Materials, Shin-Etsu Chemical, Shinko Electric, Sumitomo Chemical, Sekisui Chemical, Tokyo Oka Kogyo, Nagase Sangyo, Nitto Denko, Nippon Electric Glass, Fujifilm, Mitsui Chemicals,
Equipment manufacturer:
Keyence, Shibaura Mechatronics, Shimadzu, Showa Denko, Disco, Toray Engineering, Nitto Denko, Hitachi High-Tech,
Universities and research institutes:
Names include the National Institute of Advanced Industrial Science and Technology, Research Association for Advanced Systems (RaaS), and the University of Tokyo.
Aim of TSMC Japan:
The 3DIC R & D Center is the world’s most advanced R & D base.
I do not intend to proceed with research and development to publish the paper.
The technology developed here is being developed as a technology for use in factories.
Develop “technology that can be applied at the industrial level that meets customer requirements, including mass production.”
Clean room facilities:
We also have various equipment for mass production, such as automatic transfer equipment and inspection equipment.
FA News-MONOist
https://monoist.itmedia.co.jp/mn/articles/2206/27/news071.html
TSMC: 일본의 3DIC 참가 멤버:
TSMC:
2022년 6월 24일,
「TSMC 재팬 3DIC 연구개발센터」의 개소식을 실시했다.
TSMC 재팬
3DIC R&D 센터
3DIC센터에서는 ‘반도체 미세화의 한계’에 도전한다.
“후공정의 3차원 패키지 양산을 가능하게 하는 기술”을 개발한다.
일본 재료 제조 업체,
장비 제조자,
연구기관과 공동연구로 실시한다.
TSMC CEO
魏哲家
「반도체의 미세 가공 기술의 물리적 한계」가 다가오는 가운데,
「3차원 패키징 기술」이 더욱 중요해지고 있다.
TSMC에서는
차세대 반도체 제조 기술로서,
후공정에서 복수 칩을 3D로 고밀도 적층하고,
하나의 반도체 역할을 하는,
3차원 적층 패키징 기술에 주력하고 있다.
참가 기업이나 단체:
재료 제조사:
아사히 카세이, 이비덴, JSR, 쇼와 전공 머티리얼즈, 신에쓰 화학 공업, 신코 전기 공업, 스미토모 화학, 세키스이 화학 공업, 도쿄 응화 공업, 나가세 산업, 닛토 전공, 일본 전기 유리, 후지 필름, 미쓰이 화학,
장비 제조자:
키엔스, 시바우라 메카트로닉스, 시마즈 제작소, 쇼와 전공, 디스코, 도레 엔지니어링, 닛토 전공, 히타치 하이테크,
대학·연구기관:
산업기술종합연구소, 첨단시스템기술연구조합(RaaS), 도쿄대학 등의 이름이 거론되고 있다.
TSMC 재팬의 목표:
3DIC 연구개발센터는 세계 최첨단 연구개발 거점이다.
종이를 내기 위한 연구개발을 진행할 생각은 없다.
여기서 개발한 기술을 공장에서 사용하기 위한 기술로 개발하고 있다.
“양산도 포함해 고객 요구에 맞는 산업 수준에서 적용할 수 있는 기술”을 개발한다.
클린룸 시설:
자동반송설비와 검사설비 등 양산을 상정한 다양한 설비 등도 준비하고 있다.
FA 뉴스 – MONOist
TSMC: Japanse 3DIC-deelnemende leden:
TSMC:
24 juni 2022,
De openingsceremonie van “TSMC Japan 3DIC R & D Center” werd gehouden.
TSMC Japan
3DIC R & D-centrum
In het 3DIC-centrum zullen we de “grenzen van de miniaturisatie van halfgeleiders” uitdagen.
Ontwikkelen van “technologie die massaproductie van 3D-pakketten in het postproces mogelijk maakt”.
Japanse materiaalmaker,
Fabrikant van apparatuur,
Uitgevoerd in gezamenlijk onderzoek met onderzoeksinstituten.
CEO van TSMC
Zoals de “fysieke limieten van halfgeleidermicrofabricagetechnologie” naderen,
“3D-verpakkingstechnologie” wordt steeds belangrijker.
Bij TSMC,
Als een technologie voor de fabricage van halfgeleiders van de volgende generatie
In het nabewerkingsproces worden meerdere chips in 3D met hoge dichtheid gelamineerd,
Om als één halfgeleider te functioneren,
We richten ons op 3D-gelamineerde verpakkingstechnologie.
Deelnemende bedrijven en organisaties:
Materiaal fabrikant:
Asahi Kasei, Ividen, JSR, Showa Denko Materials, Shin-Etsu Chemical, Shinko Electric, Sumitomo Chemical, Sekisui Chemical, Tokyo Oka Kogyo, Nagase Sangyo, Nitto Denko, Nippon Electric Glass, Fujifilm, Mitsui Chemicals,
Fabrikant van apparatuur:
Keyence, Shibaura Mechatronics, Shimadzu, Showa Denko, Disco, Toray Engineering, Nitto Denko, Hitachi High-Tech,
Universiteiten en onderzoeksinstituten:
Namen zijn onder meer het National Institute of Advanced Industrial Science and Technology, Research Association for Advanced Systems (RaaS) en de Universiteit van Tokyo.
Doel van TSMC Japan:
Het 3DIC R&D-centrum is ‘s werelds meest geavanceerde R&D-basis.
Ik ben niet van plan door te gaan met onderzoek en ontwikkeling om het artikel te publiceren.
De hier ontwikkelde technologie wordt ontwikkeld als technologie voor gebruik in fabrieken.
Ontwikkel “technologie die op industrieel niveau kan worden toegepast en die voldoet aan de eisen van de klant, inclusief massaproductie.”
Faciliteiten schone kamer:
Ook voor massaproductie beschikken wij over diverse apparatuur, zoals automatische overslagapparatuur en inspectieapparatuur.
FA News-MONOist