Denso: Participating in TSMC / Sony Semiconductor Joint Venture:
-Denso is the third largest shareholder-
Denso:
The Sony Group has decided to participate in the semiconductor joint venture JASM with TSMC.
Denso will also invest in Kumamoto Prefecture JASM.
Investing 350 million dollars (40 billion yen) and investing 10%, becoming the third largest shareholder.
TSMC:
Initially
The amount of capital investment was 7 billion dollars (800 billion yen).
this time
It will be raised to 8.6 billion dollars (980 billion yen).
Circuit line width:
Initially, “the circuit line width is planned to be 22nm-28nm (nano is one billionth)”.
This time, it was decided to “manufacture semiconductors with a circuit line width of 12 nm to 16 nm.”
Monthly production capacity:
Increased by 10,000 from the initially announced number to 55,000 (300mm wafer equivalent).
DENSO’s investment:
The target is 28 nanometer products, and it is used for ECU microcomputers.
Aim to launch in the market after 2014.
New switch
Denso to Invest US$350mn in TSMC Foundry in Japan
TSMC decided to install 22 nm to 28 nm
as well as 12 nm equipment so that the monthly production capacity of the plant increases to 55,000 12-inch wafers.
This is to manufacture automotive chips of Denso and image sensors of Sony at the same time.
Businesskorea
http://www.businesskorea.co.kr/news/articleView.html?idxno=87737