TSMC: to build semiconductor factory in eastern Germany
-In Dresden, Saxony, Germany-
-In collaboration with Bosch, Infineon, and NXP-
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Taiwan Semiconductor Manufacturing (TSMC):
On August 8, TSMC will construct its first European factory in Dresden, Saxony, eastern Germany.
TSMC establishes joint venture ESMC.
Four companies jointly built a factory. TSMC will be responsible for factory operations.
TSMC: Wei Zhejia CEO
Europe is a very promising location for semiconductor innovation, especially in the automotive and industrial sectors.
We look forward to realizing innovation with Europe’s talented human resources and our advanced silicon technology.
Investment ratio of the four companies:
70% by TSMC,
10% for Bosch, Infineon and NXP.
The total investment is expected to exceed 10 billion euros.
The investment will be made as soon as the European Commission approves subsidies based on the European Semiconductor Law.
Minister of Economy and Climate Protection: Robert Herbeck
TSMC’s investment will help secure supply of German and European semiconductors.
“Approval to start factory construction ahead of schedule” was granted.
Chancellor of Saxony: Michael Kretschmer
The construction of a semiconductor factory is a strong boost to the growth of Saxony as a base.
Saxony is an agglomeration that produces one-third of Europe’s semiconductors.
Minister for Regional Development of Saxony: Thomas Schmidt
TSMC’s entry into Europe will greatly contribute to the stability of the semiconductor supply chain.
https://www.jetro.go.jp/biznews/2023/08/9dba962cf9e1cf52.html
TSMC, Bosch, Infineon, and NXP Establish JV
to Bring Advanced Semiconductor Manufacturing to Europe
TSMC ,
Robert Bosch GmbH,
Infineon Technologies AG ,
NXP Semiconductors N.V.
today announced a plan to jointly invest in ESMC GmbH, in Dresden, Germany
to provide advanced semiconductor manufacturing services.
ESMC marks a significant step towards construction of a 300mm fab:
to support the future capacity needs of the fast-growing automotive and industrial sectors,
with the final investment decision pending confirmation of the level of public funding for this project.
The project is planned under the framework of the European Chips Act.
The planned fab
is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers
on TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology,
further strengthening Europe’s semiconductor manufacturing ecosystem
with advanced FinFET transistor technology and creating about 2,000 direct high-tech professional jobs.
ESMC aims
to begin construction of the fab in the second half of 2024 with production targeted to begin by the end of 2027.