AIST: Developed SiC monolithic power IC: One-chip integration
Toshiba: Developed triple gate IGBT: Reduced loss by 40%
The University of Tokyo: Developed 3D integrated memory: Solved the von Neumann bottleneck
Japan: 14 types of semiconductor materials: 50% of market share
Samsung Electronics:’Time of hardship’ coming: Widening gap with TSMC