AIST: Developed SiC monolithic power IC: One-chip integration
-world’s first! One-chip integration of SiC vertical MOSFET and SiC CMOS-
Development overview:
Demonstration of switching operation by integrating SiC vertical MOSFET and SiC CMOS on one chip
Developed a unique device structure to achieve both increased output current of SiC CMOS and insulation from high voltage
Expected to expand the application of power conversion equipment by reducing the size, weight, performance, and functionality.
“AIST”:
Silicon carbide (SiC) semiconductor is used.
Withstand voltage 1.2 kV class vertical MOSFET and
A drive circuit composed of CMOS,
Manufacture monolithic power ICs integrated on the same chip,
We confirmed the switching operation of the integrated monolithic power IC.
Challenges of SiC Monolithic Power ICs:
Conventionally, SiC monolithic power ICs have been used for “miniaturization and weight reduction of power conversion equipment and reduction of loss”.
But,
There was a difficult problem of achieving both high output current of SiC CMOS and insulation from high voltage.
Developed a new integrated device structure:
This time, we have newly developed a device structure unique to AIST.
Achieves increased output current at the same time in addition to high-voltage insulation of SiC CMOS.
Check switching operation:
With this technology, the CMOS drive circuit is integrated on the same chip as the SiC vertical MOSFET.
Manufactured an integrated SiC monolithic power IC and demonstrated switching operation for the first time in the world.
Technology developed this time:
Achievements that pave the way for the integration of functions such as SiC sensors and SiC logic circuits.
Expansion of applications for power conversion equipment can be expected.
2050 Carbon Neutral Realization:
Towards 2050
Power conversion equipment that applies power electronics technology,
It needs to be introduced in large quantities in various places.
Power conversion equipment:
Compact and lightweight, high performance, and high functionality
Expand the application of power conversion equipment,
It is extremely important for mass introduction.
Innovation of power devices, which play a central role in this, is indispensable.
Technology developed this time:
Achievements that pave the way for functional integration of SiC sensors and SiC logic circuits.
It is expected that the applications of power conversion equipment will expand in the future.
Details of the technology will be introduced online from May 30th to June 3rd, 2021.
The 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD)
https://www.aist.go.jp/aist_j/press_release/pr2021/pr20210530/pr20210530.html