Shibaura Institute of Technology: Fine copper wiring on fluororesin: Excimer light irradiation / line width 100 μm formation
Shibaura Institute of Technology:
Shibaura Institute of Technology Faculty of Engineering: Professor Oishi
We have developed a simple hydrophilization method for fluororesins.
In March 2020, it announced that it has developed “technology for forming fine copper wiring with a line width of 100 μm on fluorocarbon resin using light irradiation”.
Fluororesin material: 5G substrate material
“Polytetrafluoroethylene (PTFE)” has a small dielectric constant and dielectric loss.
For this reason, it has been attracting attention as a resin substrate material for 5G smartphones in which transmission signals have higher frequencies.
Conventional problems:
However, because of its water repellency, it has been difficult to form wiring and devices on PTFE until now.
This solution:
Place the fluororesin substrate in the vapor of the ammonia solution,
The process of irradiating excimer light is given,
The surface of the fluororesin substrate was made hydrophilic.
Demonstration results:
Amino groups were formed on the surface.
“Can form coordination bond between amino group and Cu2+ ion in aqueous solution”
“Cu film can be formed on fluororesin by electroless Cu plating”
It was verified by experiments.
EE Times Japan
https://eetimes.jp/ee/spv/2004/02/news023.html
Development of copper fine wiring formation technology on fluororesin using light irradiation
100μm wide copper fine wiring is formed on fluororesin material (PTFE) that is water repellent and difficult to form wiring and devices.
Wiring can be formed in a process under normal pressure without using a precious metal Pd catalyst. Simplification of process and cost reduction
Contributing to high-speed transmission of large amounts of information in the 5G era
Shibaura Institute of Technology Faculty of Engineering: Professor Oishi
We have developed a simple copper fine wiring formation technology on fluororesin.
This technology makes it possible to form fine copper wiring on fluorocarbon resin that is water repellent and difficult to bond to other materials.
Without using large-scale equipment
Because the process is simple,
Cost reduction of wiring formation.
Fluororesin: 5G era
Fluororesin is expected to play a role in improving processing performance, which is necessary for high-speed transmission of large amounts of information in the 5G era.
It can be installed on semiconductor substrates.
Shibaura Institute of Technology