🚦AIST: Development of damage-less electronic component mounting technology by soldering on a low heat resistant substrate

By AIST, 5 Science

🚦AIST: Development of damage-less electronic component mounting technology by soldering on a low heat resistant substrate

– Sensor devices that extend and shrink can be realized –

point

  1. Develop technology for mounting electronic components on solder on low heat resistant substrate such as PET and elastic material
  2. By using only the magnetic field component of microwave, solder is instantaneously heated to achieve implementation in a short time
  3. Contributing to diversification of next-generation IoT devices such as extendable wearable sensor devices

http://www.aist.go.jp/aist_j/press_release/pr2018/pr20180209/pr20180209.html

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