DAIHEN: Semiconductor wafer transfer robot is amazing
-Developing the fastest robot in the world-
Daihen:
Achieved the world’s fastest level of high-speed transportation in a vacuum environment.
Developed the semiconductor wafer transfer robot “UT-VDW3000”.
Semiconductor wafer transfer robot
UT-VDW3000
We started accepting orders immediately.
Installed in the semiconductor manufacturing equipment in the previous process
In-equipment transfer, the number of wafers processed per hour,
30% improvement compared to conventional products, achieving 650 sheets.
Increased semiconductor production capacity:
It contributes to “expanding the production capacity of semiconductors, which are in short supply, without increasing the number of devices.”
Aim for annual sales of 300 units.
Features of the developed robot:
The dual arm structure is compatible with 300 mm wafers.
The arm operating stroke is 620 mm.
The minimum turning diameter of the robot is 730 mm.
The main target is “ion implanters that require high-speed processes under vacuum”.
The price excluding consumption tax is 7.8 million yen.
Transport under vacuum:
The suction type robo cannot grip the wafer under vacuum.
The newly developed robot is mounted on the hand and transported at high speed.
Achieves high-speed transportation:
At high speeds, the wafer is more likely to be misaligned due to vibration.
We thoroughly reviewed the causes of vibration.
Clean transfer robot for semiconductors:
DAIHEN puts the vacuum robot at the core.
Expand the product lineup of clean transfer robots for semiconductors.
Production will be carried out at Daihen Tech (Kitsuki City, Oita Prefecture).
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Wafer Transfer Robot | Clean Transfer Robot | Products | DAIHEN Corporation