TSMC: Evaluation line at AIST: 3DIC R & D Center
-20 Japanese companies, next-generation semiconductor technology development-
The adoption was announced this time, “Development of advanced semiconductor manufacturing technology”
TSMC Japan 3DIC R & D Center has been entrusted with “implementation technology for high-performance computing”.
Joint implementation company:
In material manufacturers,
Asahi Kasei,
Ibiden,
JSR,
Showa Denko Materials,
Shin-Etsu Chemical,
Shinko Electric Industry,
Sumitomo Chemical,
Sekisui Chemical,
Tokyo Ohka Kogyo,
Nagase & Co., Ltd.
Nitto Denko,
Nippon Electric Glass,
Fujifilm,
Mitsui Chemicals is participating.At the equipment manufacturer,
Keyence,
Shibaura Mechatronics,
Shimadzu,
Showa Denko,
Disco,
Toray Engineering,
Nitto Denko,
Hitachi High-Tech will participate.At universities and research institutes
National Institute of Advanced Industrial Science and Technology,
Research Association for Advanced Systems (RaaS),
The University of Tokyo will participate.Realization of 3D packaging technology establishment:
Work to establish 3D package technology that realizes integration and high performance of semiconductor devices.
Focusing on board mounting technology
New processing technology, substrate material, joining process,
New joining technology, measurement technology, etc.
Combine the above and proceed with development.TSMC Japan:
TSMC Japan’s 3DIC R & D Center
In the clean room of the National Institute of Advanced Industrial Science and Technology,
We will build a process line and proceed with evaluation and verification.Edge Computing Implementation Technology:
With Research Association for Advanced Systems (RaaS),
Contracted by Sony Semiconductor Solutions.Research Association for Advanced Systems:
The business theme is the development of direct bonding 3D lamination technology.
WoW (Wafer on Wafer) bonding technology by low temperature hybrid bonding of Cu-Cu and
Work on the construction and implementation of CoW (Chip on Wafer) bonding technology.
National Institute of Advanced Industrial Science and Technology,
SCREEN Holdings,
Daikin Industries,
Fujifilm,
Panasonic Smart Factory,
University of Tokyo,The above participates as a co-executor.
Sony Semiconductor Solutions:
The business theme is research and development of 3D laminated element technology for post 5G edge computing semiconductors.
In image sensor stacking technology
Basic characteristics of laminated modules,
Set a pitch size target for each year,Establish elemental technologies for semiconductor manufacturing processes.
Development of common mounting technology:
Showa Denko Materials and Sumitomo Bakelite are entrusted.
Showa Denko Materials:
The business theme is the creation of a state-of-the-art package evaluation platform.
A consortium of board, equipment and material manufacturers
Set up an evaluation platform.Evaluate next-generation semiconductor packages,
Develop substrates, equipment, and materials.
Ajinomoto Fine Techno,
Uyemura,
Ebara Corporation,
Shinkawa,
Shinko Electric Industry,
Dai Nippon Printing,
Disco,
Tokyo Ohka Kogyo,
TOWA,
Namics,
Panasonic Smart Factory,
Yamaha Motor Robotics Holdings,The above will participate as a joint implementation company.
Sumitomo Bakelite:
The business theme is the development of materials for advanced packages for next-generation information and communications.
Important for improving 3D mounting density
Encapsulant for wafer level packaging,
Encapsulant for antennas,Develop technology for fine pitch of photosensitive material for rewiring.
FA News-MONOist
https://monoist.atmarkit.co.jp/mn/articles/2106/01/news065.html
AIST: Started joint research on 3D IC mounting technology
-At the Tsukuba Center, where the post-process technology development base for advanced semiconductors is located-
TSMC Japan:
TSMC Japan’s 3DIC R & D Center will carry out joint research on the development of new materials and new process technologies for 3DIC mounting at the Tsukuba Center.
3DIC R & D Center:
New materials for AIST and Japanese companies,
To evaluate and verify process technology development
Pilot line for research and development,
It will be built in the high-performance IoT device research and development building of the AIST Tsukuba West Office.