🏭Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai
Day: February 9, 2018
💡NEC and Tohoku University Succeed in AI-Based New Material Development
💡Daikin Industries releases “GREEN Multi”, the industry’s first low-warming refrigerant HFC-32 adopted
🔬A light touch for enzyme analysis
🎮SmartHome game ‘Frog fare’, over 30 million downloads in China