🏭Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai

By Semi conductor

🏭Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai.

Osaka, Japan – Panasonic Corporation announced today that Panasonic Industrial Devices Materials (Shanghai) Co., Ltd. (PIDMSH) will start high-volume manufacturing of molded underfill (MUF)[1] materials for advanced semiconductor packages in March 2018 in response to the increasing demand for these products in China.

Headquarters News | Panasonic Newsroom Global

http://news.panasonic.com/global/press/data/2018/02/en180208-2/en180208-2.html

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