🍀Panasonic and Tokyo Seimitsu Start Taking Orders for Their Jointly Developed Laser Patterning Machine for Plasma Dicing

By LSI, Semi conductor

🍀Panasonic and Tokyo Seimitsu Start Taking Orders for Their Jointly Developed Laser Patterning Machine for Plasma Dicing

– A presentation panel to be exhibited at SEMICON China 2018 scheduled to start in Shanghai from March 14 –

Tokyo, Japan – Panasonic Corporation, and Tokyo Seimitsu Co., Ltd. (hereinafter Tokyo Seimitsu) today announced that Tokyo Seimitsu and Panasonic’s subsidiary’s company, Panasonic Smart Factory Solutions Co., Ltd. (hereinafter PSFS) have started taking orders for the AL300P, Laser patterning machine for Plasma dicing process jointly developed by the two companies. The AL300P is a new product designed for the Plasma dicing process that achieves chips to be diced from a silicon wafer without damage.

http://news.panasonic.com/jp/press/data/2018/03/jn180312-1/jn180312-1.html

http://news.panasonic.com/global/press/data/2018/03/en180312-2/en180312-2.html

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