02/09/18 Friday | Tokio X'press - Part 2

🏭松下在上海推出模制底部填充半导体封装材料

02/09/18 FridayBy Tokio X'press Semi conductor Panasonic

💡NEC与东北大学合作开发基于AI的新材料

02/09/18 FridayBy Tokio X'press AI, 4 IT NEC and Tohoku University

💡大金工业（Daikin Industries）发布了业内首款采用HFC-32的低温制冷剂“GREEN Multi”

02/09/18 FridayBy Tokio X'press Air conditioner, Electric Daikin

🔬酶分析的轻触

02/09/18 FridayBy Tokio X'press Riken, 5 Science enzymes

🎮SmartHome游戏“青蛙票价”，在中国的下载量超过3000万

02/09/18 FridayBy Tokio X'press Game, Entertainment hit-point