Mitsubishi Electric: 60% improvement in SiC and GaN slice: Wafer slicing for next-gen semiconductors Wednesday September 18th, 2019By Tokio X'press Semi conductor, precision
Mitsubishi Electric: World’s first metal corrosion sensor developed: mounted on printed circuit board Wednesday September 11th, 2019By Tokio X'press Sensor, Semi conductor
USHIO: Mass production of semiconductors using EUV: “Extreme ultraviolet lithography” light source technology Friday September 6th, 2019By Tokio X'press Semi conductor, Diode
USHIO INC. Received the First Acceptance of the EUV Light Source for Mask Inspection to EUV Lithography Mass Production Process Friday September 6th, 2019By Tokio X'press Semi conductor, Diode
NEDO: GaN-HEMT with single crystal diamond substrate: For mobile base stations 、 satellite communications Tuesday September 3rd, 2019By Tokio X'press Semi conductor, Diode