Mitsubishi Electric: 60% improvement in SiC and GaN slice: Wafer slicing for next-gen semiconductors
Mitsubishi Electric: Multi-wire EDM machine
Mitsubishi Electric has been developing a new multi-discharge slice technology “D-SLICE”.
On November 1, 2019, we announced the release of the DS1000 multi-wire electric discharge slicing machine.
Next-generation semiconductor materials: Wafer slices
We propose the use of next-generation semiconductor materials such as SiC (silicon carbide) and GaN (gallium nitride) in the wafer slicing process.
“D-SLICE”: New multi-discharge slice technology
Combines wire EDM technology and multi-wire control technology.
Slicing like a multi-wire saw is possible by electrical discharge machining.
Slicing by multi-wire electric discharge machining and cutting out wafers
Easily process for ’difficult-to-cut materials’ such as SiC and GaN.
It is possible to minimize the groove width by non-contact machining, which is a feature of EDM.
Running costs can also be reduced because no abrasive grains are required.
MONOist
https://monoist.atmarkit.co.jp/mn/spv/1909/13/news044.html
http://www.mitsubishielectric.co.jp/news/2019/0912.html?cid=rss