The University of Tokyo: Developed 3D integrated memory: Solved the von Neumann bottleneck
Japan: 14 types of semiconductor materials: 50% of market share
Samsung Electronics:’Time of hardship’ coming: Widening gap with TSMC
S.Korea: Send official documents to Renesas and others: “Semiconductor supply request”
TSMC: Evaluation line at AIST: 3DIC R & D Center