Tokyo Electron: Provided to ASML: Next Generation Coater / Developer
AIST: Developed SiC monolithic power IC: One-chip integration
Toshiba: Developed triple gate IGBT: Reduced loss by 40%
The University of Tokyo: Developed 3D integrated memory: Solved the von Neumann bottleneck
Japan: 14 types of semiconductor materials: 50% of market share