Tokyo Univ: Achieves high-efficiency heat dissipation for power semiconductors: Heat spreader
Osaka Univ: Ultra-low thermal resistance SiC power module: Silver sintered joining tech
Toshiba: Quantum cryptography communication system: Successful semiconductor chip
Nikon: Supports three-dimensional semiconductors: ArF immersion exposure equipment
COVID-19: Virus detection with semiconductor sensor: PCR and antigen test