Mitsubishi Heavy Industries: Room Temperature Wafer Bonding Equipment/Bond Meister: Targeting the Chinese Market
-Increased demand for advanced devices for 5G-
Mitsubishi Heavy Industries Machine Tool:
Establish a system to consistently propose equipment sales and contract processing for room temperature wafer bonding in the Chinese market.
Therefore, we will cooperate with D Process Co., Ltd. (Kanagawa Prefecture), which is a consignment processing.
US-China relationship:
Due to the deterioration of relations with the United States, the Chinese government is supporting the domestic production of 5G-related equipment.
In China, demand for room temperature bonding equipment, which is essential for filter manufacturing, is expected to increase.
Room temperature bonding equipment is indispensable for manufacturing communication devices such as smartphones and surface acoustic wave (SAW) filters.
Mitsubishi Heavy Industries and D Process:
Focusing on fifth-generation communication (5G), we plan to capture demand for mass production of advanced devices.
Both companies will perform contract processing of room temperature bonding and equipment sales.
Aim to achieve sales of 2 billion to 3 billion yen in 3 years.
Room Temperature Wafer Bonding Equipment: “Bond Meister”
Unique technology from Japan that “bonds two wafers firmly at room temperature”.
No thermal distortion or thermal stress due to joining,
It is easy to respond to miniaturization
The device quality can also be stabilized.
Mitsubishi Heavy Industries Machinery Co., Ltd. released the “Bond Meister” room-temperature wafer bonding equipment using the same technology in 2005 and holds the top market share in the industry.
D Process Company: Chemical Mechanical Polishing (CMP)
Materials such as gold, oxide film, and gallium nitride are handled in room temperature bonding.
We are engaged in chemical mechanical polishing (CMP) contract processing, which is optimal for these metals.
In 20009, we also started contract processing of room temperature bonding using BondMeister.
We provide services to 100 companies worldwide.
Contract processing from China:
D Process is strengthening its responsiveness, including contract processing from China.
It has also begun to consider introducing two Bond Meisters by the end of this year, and introducing five in Japan.
New Switch
Room Temperature Wafer Bonding Machine BOND MEISTER｜Mitsubishi Heavy Industries Machine Tool Co., Ltd.
https://www.mhi-machinetool.com/en/products/detail/wafer_bonding_machine.html