Shin-Etsu Chemical: 5G electronic devices: ‘Quartz cloth’ for thermosetting low dielectric resin for radar
Shin-Etsu Chemical: 5G electronic device
Shin-Etsu Chemical Co., Ltd. has launched new products to meet the needs of 5G.
For electronic devices used in 5G high frequency band:
Circuit board used in 5G high frequency band,
Antenna used in 5G high frequency band,
For radar dome;
“Quartz cloth“,
“thermosetting low dielectric resin”.
Newly developed
This development: NOVOSET.LLC
For this development, we have concluded a “manufacturing and sales license agreement for thermosetting low dielectric resin developed by NOVOSET” with NOVOSET.LLC (headquartered in New Jersey, USA).
Details of each product are as follows.
1) Quartz cloth (product name: SQX series)
Dielectric constant of 3.7 or less,
Dielectric tangent 0.001 or less,
Linear expansion coefficient 1 ppm / ° C or less,
The transmission loss characteristic (degree of deterioration of the electric signal) is extremely excellent.
5G Keywords: Quartz Cloth
Ideal as a core material for wiring boards that support ultra-high-speed communication.
Demonstrates its properties as a fiber-reinforced plastic member for antennas and radar domes.
Quartz cloth is
Material made of very thin quartz thread,
It is possible to reduce the thickness to 20 μm or less,
It is possible to cope with thinning of a laminated substrate.
Quartz cloth is
It has the feature that generation of α rays is extremely small,
Malfunction of the device due to radiation can be prevented.
2) Thermosetting low dielectric resin (Product name: SLK series)
High-strength, low-elastic resin with low dielectric properties approaching that of fluororesin.
In high frequency band (10-80GHz)
Dielectric constant 2.5 or less,
Dielectric tangent 0.0025 or less
It achieves the lowest level as a thermosetting resin.
Low dielectric resin
It has low moisture absorption and high adhesion to low roughness copper foil.
Ideal for use in FCCL (flexible copper-clad laminates) and adhesives.
As a binder for high-speed communication boards, it is also highly evaluated by customers.
Also plans to sell low dielectric sealing materials and low dielectric high thermal conductive adhesives for applications such as RF devices and antennas
The low dielectric resin licensed with NOVOSET is a material with high heat resistance, low dielectric properties and extremely low hygroscopicity.
Low dielectric resin: application fields
CCL (copper clad laminate), which requires high heat resistance,
Rigid laminated substrate
Communication base station antenna,
Expand market for radar dome.
3) Heat dissipation sheet (Product name: SAHF series)
In order to achieve heat dissipation characteristics at 5G,
Adhesive sheet combined with heat dissipation material,
Sheets that melt, cure and bond with heat
Will be newly developed and sold.
We have products with a thermal conductivity of 5W / mK to 100W / mK, and develop them in the power semiconductor and automotive fields.
News | Shin-Etsu Chemical
https://www.shinetsu.co.jp/jp/news/Shin-Etsu Chemical launches 5g-related products /
https://www.shinetsu.co.jp/jp/news/信越化学が５g関連製品の市場投入を開始/