Author: Tokio X'press
📡NEC succeeds in simultaneous digital beamforming that supports 28 GHz band for 5G communications
🏭Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai
💡NEC and Tohoku University Succeed in AI-Based New Material Development
💡Daikin Industries releases “GREEN Multi”, the industry’s first low-warming refrigerant HFC-32 adopted