Panasonic Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive Electronics
Panasonic’s new underfill products increase the reliability of automotive electronic systems by reinforcing the solder connections between semiconductor packages and printed circuit boards to meet stringent industry requirements.
Osaka, Japan – Panasonic Corporation announced today that it has commercialized temperature resistant secondary underfill [1] series CV5794 for automotive electronic applications. Mass production is scheduled to start in October 2018.
Automotive electronics are becoming increasingly sophisticated and ubiquitous. Advanced Driver Assistance Systems (ADAS), In-Vehicle Infotainment (IVI) and other systems are challenging the current design and reliability capabilities of semiconductor packaging and circuit board assembly processes.
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