Semi conductor | Tokio X'press - Part 52

中国半导体：先进EUV曝光设备的采购风险：中芯国际推迟了三代

07/30/20 ThursdayBy Tokio X'press LSI, EUV, Semi conductor, Diode

DNP：开发了5nm兼容的光掩模工艺：用于EUV光刻

07/21/20 TuesdayBy Tokio X'press Semi conductor, Diode

SiC-MOSFET结构的剖面图来源：三菱电机

07/16/20 ThursdayBy Tokio X'press Semi conductor, Diode

NEDO：Edge AI芯片：功效10倍，SLAM处理时间为1/20

07/14/20 TuesdayBy Tokio X'press LSI, AI, Semi conductor, Diode

日本：半导体制造商，韩国本地生产：Tosoh，ADEKA，东京电子

06/23/20 TuesdayBy Tokio X'press Semi conductor, Diode

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