博世：开始生产硅片：全自动进行250个工艺
德国博世：
位于德国德累斯顿的一家半导体工厂正在准备批量生产。
开始制造硅晶片（照片）。
完全自动化250个流程
建立高效的生产体系。
应对半导体需求的快速增长。
计划在2021年下半年开始大规模生产半导体。
德累斯顿工厂：
实施了先进的网络，
以现实的方式在制造设备之间交换数据，以提高半导体芯片制造的效率。
工厂占地面积约100,000平方米，
总建筑面积为72,000平方米，
计划最多雇用700名员工。
处理直径为300毫米的晶圆。
投资额约10亿欧元（约1300亿日元）
功率半导体制造：
从2009年1月开始制造原型。
目前，我们已进入可以将微芯片原型整合并测试到电子组件中的阶段。
生产用于EV和HV上安装的DC / DC转换器的功率半导体。
新开关
Bosch reaches milestone on the way to opening new wafer fab in Dresden First wafers pass through fully automated fabrication process
Harald Kroeger:
“Chips for tomorrow’s mobility solutions will soon be produced in Dresden.”
Pioneer in Industry 4.0: Bosch to use connected and highly automated processes in chip production from the outset.
Highly sophisticated process: fabrication of a chip from a wafer involves several hundred steps.
Dresden, Germany
It is a milestone on the path to the chip factory of the future:
at the new Bosch semiconductor fab in Dresden, silicon wafers are passing through the fully automated fabrication process for the first time.
This is a key step toward the start of production operations, which is scheduled for late 2021.
Manufacturing of automotive microchips will be a primary focus when the fully digital and highly connected semiconductor plant is up and running.
The company
already operates a semiconductor fab in Reutlingen near Stuttgart.
The new wafer fab in Dresden
is Bosch’s response to the surging number of areas of application for semiconductors,
as well as a renewed demonstration of its commitment to Germany as a high-tech location.
Bosch is investing
^_^around one billion euros in the high-tech manufacturing facility, which will be one of the most advanced wafer fabs in the world.
Bosch Media Service