💡Development of new technology that suppresses environmental burden that allows pretreatment in resin plating and formation of underlayer under vacuum
In Shimadzu Corporation, in a resin plating process for forming a metal film on a resin base material such as ABS, a new technology that uses a high-speed sputtering device to reduce the environmental burden by pretreating the surface of the base material and forming the base layer under vacuum Has been developed.
Conventional resin plating is a process from pretreatment to formation of underlayer, hexavalent chromium which is the cause of environmental burden and expensive metal catalyst are used. On the contrary, since the new technology developed this time does not use hexavalent chromium or a metal catalyst because it performs pretreatment by plasma under vacuum and formation of an underlayer by sputtering, it is expected to reduce environmental burden and cost I can do it. In case
2017 | News | Shimadzu Corporation