味之素:超薄膜绝缘,100%份额:CPU制造必不可少的

味之素:超薄膜绝缘,100%份额:CPU制造必不可少的

日本食品公司的技术:

CPU,可以说是个人计算机的心脏。

日本食品公司的技术对于制造该CPU是必不可少的。

众所周知,“日本食品公司正在压制关键点”。

中国媒体《 aku屋》杂志发表了一篇介绍这家食品公司的文章。

味之素有限公司:

文章介绍了“味之素有限公司”。

制造CPU需要高性能的绝缘材料。

超薄薄膜绝缘:

味之素将专有技术应用于氨基酸。

我的研究重点是具有绝缘性能的环氧树脂。

结果,据报道他开发了一种超薄膜状的绝缘材料。

100%的份额:

他指出,这种高性能绝缘材料目前在世界市场上占有100%的份额。

没有味之素的绝缘材料,即使是举世闻名的半导体制造商也无法制造。

看来这完全取决于味之素。

日本公司的优点:

“的确,尽管日本公司并不引人注目,但它们一直压制该行业的关键点。”

中国制造商倾向于自我呼吁并称赞自己。

可以说天地之间是有区别的。

中国搜索

http://news.searchina.net/id/1697895?page=1

Ajinomoto Build-up Film | Innovation in action |

Innovation

It is not commonly known that the Ajinomoto Group provides a benchmark component of computers.

In fact, Ajinomoto Build-up Film (ABF)

can be found at the heart of most of the world’s personal computers, where it provides electrical insulation of complex circuit substrates for high-performance central processing units (CPUs).

The story of ABF

begins in the 1970s, sees its initial adoption in personal computers in the late 1990s, and continues to evolve to this day in concert with advances in CPU performance.

The need for advanced CPU substrates

grew rapidly in the 1990s with the transition from MS-DOS to Windows operating systems, the rise of large-scale integration in CPUs for personal computers, and the increase in terminals from about 40 in early CPUs to a thousand or more today.

This led to a shift from “lead frame” configurations to CPUs

mounted on multilayer circuit substrates containing complex wiring patterns, creating an urgent demand for new insulating materials.

Ajinomoto Group Global Website – Eat Well, Live Well.

https://www.ajinomoto.com/innovation/action/buildupfilm